This film device fabrication:

Dual compartment glovebox with built in evaporator, spinner, hot plate, scale.

3 thermal evaporators,

assorted sonicators,

multiple, programmable spin coaters,

spray coaters,

dip coaters,

automated drawblade,

Alpha Stepper,

assorted vacuum ovens,

ozone cleaner,

lithography light box,

hot pates,

stirrers,

glass cutter

Printing:

Dimatix 3D rapid prototyping system

PECVD:

Perkin Elmer RIE/PECVD system (coming soon)

Custom built large area PECVD (2’ x 3’)

Sputtering:

Perkin Elmer 4400 Sputtering System: 3 source, 4 target, sputtering system with sputter etch capabilities. 3 source system: 2/Deposition and 1/RF DC bias.  Capable of large substrate sequential deposit of up to 4 films.  RF and DC sputter deposition capability, 8" round cathodes, Water cooled substrate holder, Table rotation adjustable from 1 to 10 RPM, RF plasma products generator, CTI Cryo pumped deposition, Turbo pumped process chambers.

BOSCH VS24CS: Vertical 16" dim. Magnetron Sputtering System, 24"x12" chamber w/ dual 19" instrument rack, CTI CryoTorr 8 pump, w/ high conductance valve, 2KW RF power supply with matching system. Temperature and Thickness control, VCS vacuum system controller provides automatic valve sequencing, pressure readout and complete executive control of process.